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ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 isolated 5-v full and half-duplex rs-485 transceivers check for samples: ISO3080, iso3086 iso3082, iso3088 1 features applications ? security systems ? 4000-v peak isolation, 560-v peak v iorm ? chemical production ? ul 1577, iec 60747-5-2 (vde 0884, rev. 2), ? factory automation iec 61010-1, iec 60950-1 and csa ? motor/motion control approved ? hvac and building automation networks ? bus-pin esd protection ? networked security stations ? 16 kv hbm between bus pins and gnd2 ? 6 kv hbm between bus pins and gnd1 ISO3080 full-duplex 200 kbps ? 1/8 unit load ? up to 256 nodes on a bus iso3086 full-duplex 20 mbps ? meets or exceeds tia/eia rs-485 iso3082 half-duplex 200 kbps requirements iso3088 half-duplex 20 mbps ? signaling rates up to 20 mbps ? thermal shutdown protection ? low bus capacitance ? 16 pf (typ) ? 50 kv/ s typical transient immunity ? fail-safe receiver for bus open, short, idle ? 3.3-v inputs are 5-v tolerant description the ISO3080, and iso3086 are isolated full-duplex differential line drivers and receivers while the iso3082, and iso3088 are isolated half-duplex differential line transceivers for tia/eia 485/422 applications. these devices are ideal for long transmission lines since the ground loop is broken to allow for a much larger common-mode voltage range. the symmetrical isolation barrier of the device is tested to provide 2500 vrms of isolation for 60s between the bus-line transceiver and the logic-level interface. any cabled i/o can be subjected to electrical noise transients from various sources. these noise transients can cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and duration. these isolated devices can significantly increase protection and reduce the risk of damage to expensive control circuits. the ISO3080, so3082, iso3086 and iso3088 are qualified for use from ? 40 c to 85 c. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2008 ? 2009, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 1 2 3 4 56 7 8 9 10 11 12 13 14 15 16 r re d gnd1 nc vcc2 b a nc gnd2 de dw package vcc1 gnd1 gnd2 gnd2 gnd1 function diagram dr b a 1312 de 6 5 34 re galvanic isolation iso3082, iso3088 1 2 3 4 56 7 8 9 10 11 12 13 14 15 16 r re d gnd1 y vcc2 b z a gnd2 de dw package vcc1 gnd1 gnd2 gnd2 gnd1 de 5 d 6 r 34 re y z b a 14 11 12 13 function diagram n galvanic isolatio ISO3080, iso3086
ISO3080, iso3086 iso3082, iso3088 slos581c ? may 2008 ? revised october 2009 www.ti.com this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. absolute maximum ratings (1) value unit v cc input supply voltage, (2) v cc1 , v cc2 ? 0.3 to 6 v v o voltage at any bus i/o terminal ? 9 to 14 v v it voltage input, transient pulse, a, b, y, and z (through 100 ? , see figure 11 ) ? 50 to 50 v v i voltage input at any d, de or re terminal ? 0.5 to 7 v i o receiver output current 10 ma bus pins and gnd1 6 jedec standard 22, human body model bus pins and gnd2 16 kv test method a114-c.01 all pins 4 electrostatic esd discharge jedec standard 22, charged device 1 kv model test method c101 all pins machine model ansi/esds5.2-1996 200 v t j maximum junction temperature 150 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values except differential i/o bus voltages are with respect to network ground terminal and are peak voltage values recommended operating conditions min typ max unit v cc1 logic-side supply voltage (1) 3.15 5.5 v v cc2 bus-side supply voltage (1) 4.5 5 5.5 v v oc voltage at either bus i/o terminal a, b ? 7 12 v v ih high-level input voltage 2 vcc d, de, re v v il low-level input voltage 0 0.8 v id differential input voltage a with respect to b ? 12 12 v r l differential input resistance 54 60 ? driver ? 60 60 i o output current ma receiver ? 8 8 t j operating junction temperature ? 40 85 c (1) for 5-v operation, v cc1 or v cc2 is specified from 4.5 v to 5.5 v. for 3-v operation, v cc1 is specified from 3.15 v to 3.6v. supply current over recommended operating condition (unless otherwise noted) parameter test conditions min typ max unit re at 0 v or v cc , de at 0 v or v cc1 3.3-v v cc1 8 i cc1 logic-side supply current ma re at 0 v or v cc , de at 0 v or v cc1 5-v v cc1 10 i cc2 bus-side supply current re at 0 v or v cc , de at 0 v, no load 15 ma 2 submit documentation feedback copyright ? 2008 ? 2009, texas instruments incorporated product folder link(s): ISO3080, iso3086 iso3082, iso3088
ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 driver electrical characteristics over recommended operating conditions (unless otherwise noted) parameter test conditions min typ max unit i o = 0 ma, no load 3 4.3 v cc r l = 54 ? , see figure 1 1.5 2.3 differential output voltage | v od | v magnitude r l = 100 ? (rs-422), see figure 1 2 2.3 v test from ? 7 v to +12 v, see figure 2 1.5 change in magnitude of the ? 0.2 0 0.2 v |v od | see figure 1 and figure 2 differential output voltage steady-state common-mode 1 2.6 3 v oc(ss) output voltage see figure 3 v change in steady-state ? 0.1 0.1 v oc(ss) common-mode output voltage peak-to-peak common-mode 0.5 v v oc(pp) see figure 3 output voltage i i input current d, de, v i at 0 v or v cc1 ? 10 10 a iso3082 see receiver input current iso3088 v y or v z = 12 v, high-impedance state output v cc = 0 v or 5 v, 1 i oz current de = 0 v ISO3080 other input a iso3086 at 0 v v y or v z = ? 7 v. v cc = 0 v or 5 v, ? 1 de = 0 v v a or v b at ? 7 v other input i os short-circuit output current ? 200 200 ma at 0 v v a or v b at 12 v cmti common-mode transient immunity v i = v cc1 or 0 v, see figure 12 25 50 kv/ s driver switching characteristics over recommended operating conditions (unless otherwise noted) parameter test conditions min typ max unit ISO3080/82 0.7 1.3 t plh , propagation delay ns t phl iso3086/88 25 45 ISO3080/82 20 200 pwd (1) pulse skew (|t phl ? t plh |) see figure 4 ns iso3086/88 3 7.5 ISO3080/82 0.5 0.9 1.5 s t r , t f differential output signal rise and fall time iso3086/88 7 15 ns propagation delay, 50% vo 2.5 7 ISO3080/82 s t pzh , high-impedance-to-high-level ouput 90% vo 1.8 t pzl propagation delay, see figure 5 iso3086/88 25 55 high-impendance-to-low-level output and figure 6 , propagation delay, ISO3080/82 95 225 de at 0 v ns t phz , high-level-to-high-impedance output t plz propagaitin delya, low-level to iso3086/88 25 55 high-impedance output (1) also known as pulse skew copyright ? 2008 ? 2009, texas instruments incorporated submit documentation feedback 3 product folder link(s): ISO3080, iso3086 iso3082, iso3088
ISO3080, iso3086 iso3082, iso3088 slos581c ? may 2008 ? revised october 2009 www.ti.com receiver electrical characteristics over recommended operating conditions (unless otherwise noted) parameter test conditions min typ max unit positive-going input threshold v it(+) i o = ? 8 ma ? 85 ? 10 mv voltage negative-going input threshold v it( ? ) i o = 8 ma ? 200 ? 115 mv voltage v hys hysteresis voltage (v it+ ? v it ? ) 30 mv v cc1 - 3.3-v v cc1 3.1 v id = 200 mv, i o = ? 8 ma, 0.4 v oh high-level output voltage v see figure 7 5-v v cc1 4 4.8 3.3-v v cc1 0.15 0.4 v id = ? 200 mv, i o = 8 ma, v ol low-level output voltage v see figure 7 5-v v cc1 0.15 0.4 i o(z) high-impedance state output current v i = ? 7 to 12 v, other input = 0 v ? 1 1 a v a or v b = 12 v 0.04 0.1 v a or v b = 12 v, v cc = 0 0.06 0.13 i i bus input current other input at 0 v ma v a or v b = ? 7 v ? 0.1 ? 0.04 v a or v b = ? 7 v, v cc = 0 ? 0.05 ? 0.03 i ih high-level input current, re v ih = 2 v ? 10 10 a i il low-level input current, re v il = 0.8 v ? 10 10 a r id differential input resistance a, b 48 k ? test input signal is a 1.5 mhz sine wave with 1vpp c d differential input capacitance 7 pf amplitude. cd is measured across a and b. receiver switching characteristics over recommended operating conditions (unless otherwise noted) parameter test min typ max unit conditions t plh , t phl propagation delay 90 125 ns pwd (1) pulse width distortion |t phl ? t plh | see figure 8 4 12 t r , t f output signal rise and fall time 1 ns t pzh , propagation delay, high-level-to-high-impedance output see figure 9 , 22 ns de at 0 v t pzl propagation delay, high-impedance-to-high-level output t phz , propagation delay, high-impedance-to-low-level output see figure 10 , 22 ns de at 0 v t plz propagation delay, low-level-to-high-impedance output (1) lso known as pulse skew. parameter measurement information figure 1. driver v od test and current definitions figure 2. driver v od with common-mode loading test circuit 4 submit documentation feedback copyright ? 2008 ? 2009, texas instruments incorporated product folder link(s): ISO3080, iso3086 iso3082, iso3088 0 or i i v i v cc1 de a b v ob v oa v od i oa i ob gnd 1 gnd 1 gnd 2 v cc1 gnd 2 375 w 60 w + v od - d de gnd 2 v cc2 ab -7 v to12 v 0 or3 v 375 w
ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 parameter measurement information (continued) figure 3. test circuit and waveform definitions for the driver common-mode output voltage figure 4. driver switching test circuit and voltage waveforms figure 5. driver high-level output enable and disable time test circuit and voltage waveforms copyright ? 2008 ? 2009, texas instruments incorporated submit documentation feedback 5 product folder link(s): ISO3080, iso3086 iso3082, iso3088 input generator 50 w 3 v if testing a output , 0 v if testing b output s1 c l includes fixture and instrumentation capacitance d a de 50% 50% 3 v v oh t pzh t phz 50% 90% 0 v v o v i 3 v or 0 v v i gnd 1 v o c = 50 pf 20% l r = 110 1% l w generator prr = 50 khz, 50% duty cycle, t <6ns, t <6ns, z = 50 r f o w 0 v ~~ input i i v i v cc1 de a b v ob v oa v od i oa i ob gnd2 gnd1 gnd1 gnd2 v oc 27 w v oc b v b v a a v oc(ss) oc(p-p) v 27 w generator: prr= 100 khz, 50 % duty cycle, t r < 6ns , t f < 6 ns , z o = 50 w input v od 50 w d a b de v cc1 v i input generator generator: prr = 100 khz, 50 % duty cycle , t r < 6ns , t f <6 ns , z o = 50 3 v t f t r t plh t phl 10% 90% v od v i 90% 10% v od(h) v od(l) includes fixture and instrumentation capacitance l c 50% 50% gnd 1 r = 54 1% l w c = 50 pf 20% l 50% 50%
ISO3080, iso3086 iso3082, iso3088 slos581c ? may 2008 ? revised october 2009 www.ti.com parameter measurement information (continued) figure 6. driver low-level output enable and disable time test circuit and voltage waveform figure 7. receiver voltage and current definitions figure 8. receiver switching test circuit and waveforms figure 9. receiver enable test circuit and waveforms, data output high 6 submit documentation feedback copyright ? 2008 ? 2009, texas instruments incorporated product folder link(s): ISO3080, iso3086 iso3082, iso3088 50% v oh t pzh t phz 50% 3 v 90% v i v o 0 v 50% v cc input generator 50 w r ab c includesfixture l andinstrumentation capacitance re v i v o c l = 15 pf 20 % s1 1 k w 1.5 v 0 v generator:prr=100 khz, 50% duty cycle , r <6ns, t f <6ns, z o = 50 w t 1% v id i o ab r i b i a v ic v a v b v b v a + 2 v o input generator 1.5 v c includes fixture and l instrumentation capacitance ab r v o v i re 50 w generator: prr=100 khz, 50% duty cycle, r < 6ns, t f < 6ns, z o = 50 w t 50% 50% 3 v v oh v ol t f t r t plh t phl 10% 90% 50% 50% 0 v v o v i c = 15 pf 20% l gnd 2 input generator 50 w 3 v or 0 v s1 3v d ab de v i c includes fixture and l instrumentation capacitance generator: prr =50 khz ,50% duty cycle, r < 6ns, t f < 6ns, z = 50 t 0 v if testing a output , 3 v if testing b output 50% 3v v ol t pzl t plz 10% v o v i 5v 50% 50% c = 50 pf 20% l r = 110 1% l w 0 v
ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 parameter measurement information (continued) figure 10. receiver enable test circuit and waveforms, data output low figure 11. transient over-voltage test circuit figure 12. half-duplex common-mode transient immunity test circuit copyright ? 2008 ? 2009, texas instruments incorporated submit documentation feedback 7 product folder link(s): ISO3080, iso3086 iso3082, iso3088 v cc input generator 50 w r ab c includes fixture l and instrumentation capacitance re v i v o c l = 15 pf 20% s1 0 v 1.5 v generator: prr =100 khz, 50% duty cycle, r < 6 ns, t f < 6ns, z o = 50 w t 50% 3 v 0 v v i v cc v ol t pzl t plz v o 50% 50% 10% 1 k 1% w d r dere 54 w gnd1 v test gnd2 ab gnd1 s1 2 v 0.8 v v or v oh ol 1 k w cl = 15 pf (includes probe and jig capacitance) v or v oh ol v cc1 v cc2 c = 0.1 f 1% m c = 0.1 f 1% m a b pulse generator 15 s duration 1% duty cycle t , t 100 ns m r f r note:this test is conducted to test survivability only. data stability at the r output is not specified. d +_ re de 0v 3v 100 1% w
ISO3080, iso3086 iso3082, iso3088 slos581c ? may 2008 ? revised october 2009 www.ti.com parameter measurement information (continued) figure 13. full-duplex common-mode transient immunity test circuit device information table 1. driver function table enable input input outputs (d) v cc1 v cc2 (de) y z pu pu h h h l pu pu l h l h pu pu x l z z pu pu x open z z pu pu open h h l pd pu x x z z pu pd x x z z pd pd x x z z table 2. receiver function table differential input enable output v cc1 v cc2 v id = (v a ? v b ) ( re) (r) pu pu ? 0.01 v v id l h pu pu ? 0.2 v < v id < ? 0.01 v l ? pu pu v id ? 0.2 v l l pu pu x h z pu pu x open z pu pu open circuit l h 8 submit documentation feedback copyright ? 2008 ? 2009, texas instruments incorporated product folder link(s): ISO3080, iso3086 iso3082, iso3088 d dere 54 w gnd1 v test gnd2 ab gnd1 s 1 1.5 v or 0 v 0 v or 1.5 v z y 2 v 0.8 v c = 0.1 f 1% m c = 0.1 f 1% m v cc1 v cc2 1 k w 54 w cl = 15 pf (includes probe and jig capacitance) v or v oh ol v or v oh ol
ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 table 2. receiver function table (continued) differential input enable output v cc1 v cc2 v id = (v a ? v b ) ( re) (r) pu pu short circuit l h pu pu idle (terminated) bus l h pd pu x x z pu pd x l h package characteristics over recommended operating conditions (unless otherwise noted) parameter (1) test conditions min typ max unit shortest terminal to terminal distance through l(i01) minimum air gap (clearance) 8.34 mm air shortest terminal to terminal distance across l(i02) minimum external tracking (creepage) 8.1 mm the package surface tracking resistance (comparative tracking cti din iec 60112 / vde 0303 part 1 175 v index) minimum internal gap (internal clearance) distance through the insulation 0.008 mm input to output, v io = 500 v, all pins on each r io isolation resistance side of the barrier tied together creating a > 10 12 ? two-terminal device c io barrier capacitance input to output vi = 0.4 sin (4e6 t) 2 pf c i input capacitance to ground vi = 0.4 sin (4e6 t) 2 pf (1) creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the isolation glossary. techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. iec 60664-1 ratings table parameter test conditions specification basic isolation group material group iiia rated mains voltage 150 v rms i-iv installation classification rated mains voltage 300 v rms i-iii rated mains voltage 400 v rms i-ii iec 60747-5-2 insulation characteristics (1) over recommended operating conditions (unless otherwise noted) parameter test conditions specification unit maximum working insulation v iorm 560 v voltage method b1, v pr = v iorm 1.875, v pr input to output test voltage 1050 v 100% production test with t = 1 s, partial discharge < 5 pc v iotm transient overvoltage t = 60 s 4000 v r s insulation resistance v io = 500 v at t s > 10 9 ? pollution degree 2 (1) climatic clasification 40/125/21 copyright ? 2008 ? 2009, texas instruments incorporated submit documentation feedback 9 product folder link(s): ISO3080, iso3086 iso3082, iso3088
ISO3080, iso3086 iso3082, iso3088 slos581c ? may 2008 ? revised october 2009 www.ti.com regulatory information vde csa ul approved under csa component recognized under 1577 component certified according to iec 60747-5-2 acceptance notice recognition program (1) file number: 40016131 file number: 1698195 file number: e181974 (1) production tested 3000 vrms for 1 second in accordance with ul 1577. iec safety limiting values safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. a failure of the io can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. parameter min typ max unit safety input, output, or supply ja = 212 c/w, v i = 5.5 v, t j = 170 c, i s dw-16 210 ma current t a = 25 c t s maximum case temperature dw-16 150 c the safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. the power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. the assumed junction-to-air thermal resistance in the thermal characteristics table is that of a device installed in the jesd51-3, low effective thermal conductivity test board for leaded surface mount packages and is conservative. the power is the recommended maximum input voltage times the current. the junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. thermal characteristics over recommended operating conditions (unless otherwise noted) parameter test conditions min typ max unit low-k thermal resistance (1) 168 ja junction-to-air c/w high-k thermal resistance 96.1 jb junction-to-board thermal resistance 61 c/w jc junction-to-case thermal resistance 48 c/w v cc1 = v cc2 = 5.25 v, t j = 150 c, c l = 15 pf, p d device power dissipation 220 mw input a 20 mhz 50% duty cycle square wave (1) tested in accordance with the low-k or high-k thermal metric defintions of eia/jesd51-3 for leaded surface mount packages. 10 submit documentation feedback copyright ? 2008 ? 2009, texas instruments incorporated product folder link(s): ISO3080, iso3086 iso3082, iso3088
ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 figure 14. dw-16 jc thermal derating curve per iec 60747-5-2 copyright ? 2008 ? 2009, texas instruments incorporated submit documentation feedback 11 product folder link(s): ISO3080, iso3086 iso3082, iso3088 0 25 50 75 100 125 150 0 50 100 150 200 t - case temperature - c c safety limiting current -- ma v at 5.5 v cc1,2
ISO3080, iso3086 iso3082, iso3088 slos581c ? may 2008 ? revised october 2009 www.ti.com equivalent circuit schematics 12 submit documentation feedback copyright ? 2008 ? 2009, texas instruments incorporated product folder link(s): ISO3080, iso3086 iso3082, iso3088 d and re input de input 16 v16 v v cc input a input 16 v 16 v v cc input b input 36 k w 3.3v r output 36 k w 180 k w 36 k w 180 k w 36 k w 1 m w input v cc1 v cc1 500 w 1 m w input v cc1 v cc1 500 w v cc1 v cc1 v cc1 6.4 w 11 w 4 w 5.5 w 5v r output y and z outputs 16 v16 v output v cc
ISO3080, iso3086 iso3082, iso3088 www.ti.com slos581c ? may 2008 ? revised october 2009 revision history changes from original (may 2008) to revision a page ? changed the package characteristics table - l(101) minimum air gap (clearance) from 7.7mm to 8.34mm .................. 9 ? deleted the csa column from the regulatory information table. ..................................................................................... 10 ? changed the file number in the vde column of the regulatory information table from: 40014131 to: 40016131 .......... 10 changes from revision a (june 2008) to revision b page ? changed features bullet from: 4000-v peak isolation, to: 4000-v peak isolation,, 560-v peak v iorm ..................................... 1 ? added features sub bullet: ul 1577, iec 60747-5-2 (vde 0884, rev. 2), iec 61010-1, iec 60950-1 and csa approved ............................................................................................................................................................................... 1 ? added the csa column to the regulatory information table .............................................................................................. 10 changes from revision b (december 2008) to revision c page ? changed recommended operatings condition table note from: for 3-v operation, v cc1 or v cc2 is specified from 3.15 v to 3.6v. to: for 3-v operation, v cc1 is specified from 3.15 v to 3.6v. ..................................................................... 2 copyright ? 2008 ? 2009, texas instruments incorporated submit documentation feedback 13 product folder link(s): ISO3080, iso3086 iso3082, iso3088
package option addendum www.ti.com 3-jul-2010 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) ISO3080dw active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples ISO3080dwg4 active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples ISO3080dwr active soic dw 16 2000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year contact ti distributor or sales office ISO3080dwrg4 active soic dw 16 2000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year contact ti distributor or sales office iso3082dw active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples iso3082dwg4 active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples iso3082dwr active soic dw 16 2000 green (rohs & no sb/br) call ti level-2-260c-1 year contact ti distributor or sales office iso3082dwrg4 active soic dw 16 2000 green (rohs & no sb/br) call ti level-2-260c-1 year contact ti distributor or sales office iso3086dw active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples iso3086dwg4 active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples iso3086dwr active soic dw 16 2000 green (rohs & no sb/br) call ti level-2-260c-1 year contact ti distributor or sales office iso3086dwrg4 active soic dw 16 2000 green (rohs & no sb/br) call ti level-2-260c-1 year contact ti distributor or sales office iso3088dw active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples iso3088dwg4 active soic dw 16 40 green (rohs & no sb/br) call ti level-2-260c-1 year request free samples iso3088dwr active soic dw 16 2000 green (rohs & no sb/br) call ti level-2-260c-1 year contact ti distributor or sales office iso3088dwrg4 active soic dw 16 2000 green (rohs & no sb/br) call ti level-2-260c-1 year contact ti distributor or sales office (1) the marketing status values are defined as follows:
package option addendum www.ti.com 3-jul-2010 addendum-page 2 active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant ISO3080dwr soic dw 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 q1 iso3082dwr soic dw 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 q1 iso3086dwr soic dw 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 q1 iso3088dwr soic dw 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 q1 package materials information www.ti.com 23-nov-2009 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) ISO3080dwr soic dw 16 2000 358.0 335.0 35.0 iso3082dwr soic dw 16 2000 358.0 335.0 35.0 iso3086dwr soic dw 16 2000 358.0 335.0 35.0 iso3088dwr soic dw 16 2000 358.0 335.0 35.0 package materials information www.ti.com 23-nov-2009 pack materials-page 2

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